Press release from: 18 April 2013
SMARTRAC Launches Trailblazing Technologies for Electronic Identity Documents
- SMART-SL product family accommodates the need for both thin, flat, and highly durable ID card inlays
- SMART-HERA® manufacturing concept combines the highest reliability with the benefits of dual interface functionality
SMARTRAC N.V., the leading developer, manufacturer, and supplier of RFID transponders and inlays, today announced the launch of its new SMART-SL and SMART-HERA® ID card technologies. Both will be presented to industry professionals at the SMARTRAC booth (#306) at Cartes America 2013.
Building on SMARTRAC’s long-standing wafer back-end processing, antenna manufacturing, antenna-chip interconnection, and assembling experiences, the SMART-SL product family provides card manufacturers and security printers with thin, flat, and at the same time highly durable ID card inlays with a homogenously flat inlay surface.
The new ultra-thin SMART-SL products are manufactured utilizing the company’s proprietary and patented palladium bumping and wire-embedding technologies. The reduced inlay thickness of only 200µm is achieved by connecting the antenna with SMARTRAC’s unique chip die bonding technology to a copper chip-link carrier substituting commonly available chip module technology.
With the new SMART-SL products, card manufacturers are also able to benefit from:
- 10-year lifetime for RFID inlay and card functionality in the field
- Prevention of micro cracks within the card, particularly when using polycarbonate
- Easy integration of enhanced security features and additional security layers while meeting ISO card dimension specifications
- Highest possible field strength of the RF antenna and ISO compliance for HF, UHF, and NFC
- Easy implementation of multi-component cards.
The SMART-HERA® manufacturing concept consists of a specific dual interface card inlay and a dedicated machine for implanting the dual interface module into the card, resulting in the highest durability and reliability as well as the best performance available on the market.
The dual interface card inlays are based on SMARTRAC’s proprietary and patented wire-embedding technology. Following the milling of the module cavity, the dual interface modules are implanted in a fully automated process and connected to the antenna based on a soldered wire connection. The metallic antenna-chip interconnection results in highest physical durability and very high stability against mechanical stress as well as long-term bending and torsion durability.
Key benefits of the SMART-HERA® manufacturing concept are:
- 10+ years of durability for contactless ID cards made of PVC, PC, and composite materials
- Soldered metallic antenna-chip interconnection substituting ageing materials like conductive glue
- Best resonance frequency performance
- Proven and patented technologies combined with machinery made in Germany
- Cohesive manufacturing concept from inlay to quality assurance and testing.
The SMART-SL product family and the SMART-HERA® manufacturing concept are both aimed at providing card manufacturers and security printers with pioneering and standard-setting new technologies to meet tomorrow’s requirements for high-security contactless identity documents.
“The new SMART-SL and SMART-HERA perfectly complement our product range and are fully in line with our aim to provide our business partners with top-quality and durable products for identity cards and e-passports,” said Martin Kuschewski, Head of Business Unit eID and Member of the Group Executive Team. “We are very pleased to be the technology partner of choice for our global customers and to provide them with hands-on consultancy to get the best results for their respective ID project”.
SMARTRAC will present its market-leading product portfolio for electronic identity documents together with the new SMART-SL product family as well as the SMART-HERA® manufacturing concept at the SMARTRAC booth (#306) at Cartes America from April 23 to 25, 2013, at The Mirage Hotel in Las Vegas.
SMARTRAC was founded in 2000, went public in July 2006, and trades as a stock corporation under Dutch law with its registered headquarters in Amsterdam. The company currently employs approximately 3,600 employees and maintains a global research and development, production, and sales network.
If you have any questions, please contact:Tanja Moehler
Head of Corporate Communications & Marketing
Phone: +31 20 30 50 157
All forward-looking statements contained in this press release are based on assumptions, planning, and forecasts at the time of publication of this press release. Forward-looking statements always involve uncertainties. Business and economic risks and developments, the conduct of competitors, political decisions, and other factors may cause the actual results to be materially different from the assumptions, planning, and forecasts at the time of publication of this press release. Therefore, SMARTRAC N.V. does not assume any responsibility relating to forward-looking statements contained in this press release. Furthermore, SMARTRAC N.V. does not assume any obligation to update the forward-looking statements contained in this press release.